Large-area steppers
- Equipment for the production of photo masks
- Equipment for wafer pattern generation and inspection
- Assembly Equipment (die/wire bonder)
The large-area stepper family is developed by PLANAR for the flip-chip assembly of high-end chips with numerous output contacts. The flip-chip packaging in many respects determines functional performance of a chip and meets evergrowing demand for higher electrical parameters, further miniaturization, higher reliability, heat and power control at stable cost decrease.
If you require any further information, feel free to contact us:
DEPARTMENT OF MARKETING:
Phone: |
+375 17 223 71 28, |
E-mail: |
office@planar.by |
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