Tools for proximity exposure and double-side lithography
The tools are intended for pattern alignment on photomasks and wafers (substrates) and further transfer of this pattern from mask to wafer through contact (proximity) exposure of wafer photoresistive layer.
Main features:
- wedge compensation and wafer thickness compensation without contact with the photomask;
- 3 coordinates (X, Y, Q) high precision wafer manipulator with coarse and fine alignment modes;
- ability to handle 0.2 mm to 0.8 mm wafers made of fragile materials (GaAs, LiNbO3) and rectangular substrates;
- built-in vibration protection unit;
- energy saving mode.
If you require any further information, feel free to contact us:
DEPARTMENT OF MARKETING:
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Phone: |
+375 17 223 71 28, |
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E-mail: |
office@planar.by |
