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Research & Development

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At present the following equipment is under development at Planar Concern:

  • Automatic mask inspection system, pixel 0.15μm;
  • Multibeam laser pattern generator, minimum feature size 0.35μm;
  • Wafer stepper, minimum feature size 0.5; 0.35; 0.25μm;
  • Automatic ultrasonic aluminum wire bonder, wire diameter ( 100 ... 500μm);
  • Wafer mount system;
  • Automatic blister-tape packaging system for transistors.

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