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Laser Treatment System EM-230A
The system is designed for splitting of glass and glass ceramic substrates using controllable laser thermal spalling. The substrates are split along a straight line only.
The method is based on generation of a microcrack in a surface part as result of the thermal shock from local heating by laser radiation and abrupt exposing the surface to chill. Substrate motion is done by work table movement relative to the laser beam. Final splitting is done by mechanical break of the substrate following the microcrack formation.
As a result of such splitting a cut element has an edge of extremely high quality. There are no chipping, microcracks, slag and mechanical stresses, which as a rule are associated with other methods of cutting in the surface part of the edge. Controllable thermal spalling method doesn’t cause material removal from the cut area, therefore the cut hasn’t width. There are no destruction materials emitting during the thermal spalling process.
A linear step motor with feedback ensures high precision processing with linear travel speed up to 600 mm/s at speed variation not more 5% . The use of the linear step motor without friction guarantees its long service life and excludes the necessity of adjustment when operating.
Specifications
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| Laser type |
CO2 TEM00 |
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| Average power |
30 W |
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| Substrate size |
150 x 150 mm |
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| Speed of processing (for 1 mm thickness) |
100 mm/sec |
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| Accuracy, not worse than |
7 mkm |
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| Power requirements |
380/230 V, 50 Hz, 1.5 kW |
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| Overall dimensions |
1870 x 860 x 1400 mm |
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| Weight |
700 kg |
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Viewing Optics The object image received by means of TV-system is directly displayed on computer monitor. This enables alignment of a cut contour and the video. During laser processing the monitor displays current modes of the treatment.
Control and Software System The control system provides the following:
- control of all drives in automatic processing mode
and orientation mode;
- storage and automatic selection of treatment modes according to preset process parameters;
- editing of division layout within its own program;
- inspection of average laser power with display of
pictogram on computer screen;
- display on computer screen of TV-picture of surface of the substrate during its angular and position orientation;
- display on TV-screen of the on-line information (absolute and relative coordinates of the stage, process steps, prompting of operations sequence, treatment time, error warning, etc.);
- execution of special debugging operations (search for beam focus, its alignment with finder cross-hairs, etc.);
- creation and storage of the library of programs of operations including layout of division and list of process parameters;
- actuating mechanisms diagnostics.
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