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Mask Making Equipment

Laser Pattern Generators

Mask Repair Systems

Mask Inspection and Metrology

Photolithography Equipment

Steppers

Mask Aligners

Wafer Inspection and Metrology

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws

Chip Casseting

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Encapsulation Systems

Surface Mount Equipment

Laser Processing Equipment
EM-250A
EM-237

Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

Laser Processing Equipment


EM-250

Laser Treatment System is designed for material cutting, dimensional processing and cutting according to preset contour arbitrary forms in substrates of alumina, silicon and other materials

EM-250A

Laser Treatment System is designed for silicon wafer scribing, trough cutting according to a preset contour and drilling holes in substrates of silicon and other materials

EM-230A

Laser Treatment System is designed for splitting of glass and glass ceramic substrates by laser thermal spalling

EM-237

Laser Marking System is designed for marking of smart cards by controllable laser-stimulated sublimation

EM-270M

Laser Treatment System is designed for broaching profile channels (holes) in hard and superhard materials, such as natural and synthetic diamond, ruby, hard allows, aluminum ceramics, etc.

During 1970 – 1990 Planar Concern has developed, manufactured and supplied more than 500 laser treatment systems for dimension processing of semiconductor wafers (Si, Ge, GaAs), substrates of glass, ceramics (including Al2O3) and diamond articles.

30 years of experience in the design, manufacture and development of laser processing technologies enables us nowadays to build competitive equipment for laser processing of articles for radioelectronic, instrument-making and jeweller’s industries.

As a rule, technological equipment for laser treatment include a laser with power supply, machine unit with power optics, precision indexer, scan unit, electronic units, control computer, software and peripheral devices such as loading, handling, etc.

Manufacturing technologies of electronic components require high surface quality of processed articles with minimal defect area.

A solid state YAG:Nd laser with Q-switch in TEM00 mode is used as a work tool in such equipment.
Computer controlled layer-by-layer removal of material in combination with other abilities of the equipment enables achievement of high dimensional precision and surface quality.

Laser scribing is one of the first and the most popular laser applications in technological equipment for electronic industry.


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