Integrated Circuit Packing System EM-4227

The EM-4227 Integrated Circuit Packing System is intended for packing large integrated circuits into tape carrier with the following covering by coating film. The machine can process integrated circuits in SOIC, SOP type packages and from sticks. Blister tape width is 8 mm, but can be widened to 56 mm.

Feeding, picking-up and placement of components, movement of blister tape for a pitch, attachment of coating film, and reeling on are carried out automatically. Reels with blister tape and coating film and sticks are changed manually. Changeover time for different type of integrated circuits is 30 min.

The working cycle is as follows:
Sticks with integrated circuits are set in the shaking feeder. A reel with blister tape, reel with coating film and empty reel are mounted on the packing mechanism. Blister tape is unreeled, fitted in the bulge of sprockets for its pitch movement, and threaded in the empty reel.
When interrogating sensors about presence of all the mechanisms at their initial positions, the rotating device is rotated to the picking-up position. Pickup pneumatic actuator operates, and a tool is lowered on an integrated circuit, vacuum is on, the tool is lowered with the integrated circuit, and then the rotating device is rotated by an angle of 22.5° to the placement position, placement pneumatic actuator operates, the tool with the integrated circuit is lowered to the cell of blister tape. Blister tape is mover by a pitch, the tool goes up, at the same time vacuum is off, and rotating mechanism rotor is rotated. Going through heaters, coating film is welded to blister tape covering the placed integrated circuits, and reeled on.

Operation mode input and machine control is performed from the control panel.
Consumer characteristics of the machine conform to the world standards (SEMI, ISO9000).
The machine is environmentally friendly

SPECIFICATIONS

Throughput (depending on a type and size) 1700 to 6000 IC/h Integrated circuit package type SOIC, SOP Coating film heating temperature 20 to 200°C Number of tools 16 Blister tape width 8 to 56 mm X, Y moving mechanism positioning repeatability 0.02 mm Picking-up mechanism positioning repeatability 0.02 mm Coating film pulling-off force under - blister tape speed 300 mm/min 0.2 to 1.0 N - blister tape speed 120 mm/min 0.1 to 0.7 N Compressed air 0.5 to 0.6 MPa Power requirements 230 V, 50 Hz, 1.5 kW Overall dimensions 1180x1130x1750 mm Weight 650 kg