The encapsulation system is intended for die encapsulation with compound on a PCB (substrate).
The heated compound is mechanically pressed out of a dispenser fastened on a three-coordinate table (100x200mm) having a step drive, and is applied according to a programmed contour. The heating temperature of the PCB and compound is set and maintained by thermocontrollers.
The heating temperature of the PCB and compound is set and maintained by thermocontrollers.
XY PCB travel area
XY compound application accuracy, not more than
± 0.8 mm
Minimal compound layer thickness
Heating temperature of PCB and compound
40 – 150°Ñ
Encapsulation time for a 10x10 mm area with compound layer thickness 0.4 mm, no more than