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UG-1
UG-1 is designed for die encapsulation with an EO7021 compound on a PCB.
The heated compound is mechanically pressed out of a dispenser fastened on a three-coordinate table having a step drive, and is applied according to a programmed contour. The heating temperature of the PCB and compound is set and maintained by thermocontrollers.
UG-1 is equipped with a diagnostic system that facilitates troubleshooting.
Specifications
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| PCB dimensions, mm |
170õ170 |
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| XY PCB travel area, mm |
175õ175 |
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| XY compound application accuracy, not more than, mm |
±0.8 |
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| Minimal compound layer thickness, mm |
0.4 |
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| Heating temperature of PCB and compound, °Ñ |
40 ... 150 |
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| Encapsulation time for a 10x10 mm area with compound layer thickness 0.4 mm, not more than, sec |
5 |
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| Compressed air, purity class 1, MPa |
0.4 ... 0.5 |
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| Power requirements, V, Hz |
230, 50 |
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| Power consumption, kW |
0.6 |
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| Overall dimensions, mm |
1100õ1100õ1100 |
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| Weight, kg |
180 |
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