 |
Automatic Encapsulation System EM-3037
The EM-3037 Automatic Encapsulation Machine is designed for automatic application of programmed compound dose to encapsulate chip-modules on an endless tape following the “drawing” method by means of group dispensers mounted on X-Y-Z stage with the drive of rotary step motors for all the coordinates.
The machine has two zones for compound containers that ensures the required technology and height of compound layer applied.
The machine is equipped with a heater for heating compound containers, dispensers, work stages, furnace stage having temperature regulators what allows to hold temperature within ±5°C.
The machine consists of encapsulation unit, device attaching mechanism, furnace, compound layer thickness control mechanism, and control rack.
Specifications
|
| Throughput |
6000 chips/h |
|
| Compound layer height, not more |
0.25 mm |
|
| Compound layer accuracy |
|
|
| Nominal compound layer error |
±0.15 mm |
|
| Outer diameter error |
±0.25 mm |
|
| Compound container heating |
30 to 70°C |
|
| Dispenser heating |
30 to 100°C |
|
| Work stage heating |
30 to 150°C |
|
| Number of work stage heating zones |
4 |
|
| Furnace stage heating temperature range |
50 to 150°C |
|
| Number of furnace heating zones |
3 |
|
| Concentric trajectory step |
0.1 to 2.0 mm |
|
| Increment |
0.1 mm |
|
| Compressed air |
0.5 to 0.6 MPa |
|
| Vacuum |
0.02 to 0.04 MPa |
|
| Exhaust ventilation (air pressure, speed) |
0.1 to 0.25 MPa, 3.5 to 5 m/s |
|
| Power requirements |
380 V, 50 Hz, 5 kW |
|
| Overall dimensions |
3050´700´1950 mm |
|
| Weight |
700 kg |
|
|
|
|
