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EM-4370 Automatic Wire Bonder
EÌ-4370 is designed for automatic ultrasonic aluminum wedge bonding of a wide variety of devices requiring a large working area and high bond accuracy, including multichip and multilevel hybrids.
The bonder provides automatic detection of bonding pads and package lead locations including multilevel devices; individual mode programming of bonding parameters and loop shape for each wire.
Specifications
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| Õ-Y working area , mm |
100õ200 |
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| Bond speed (wire not more than 2 mm long), sec |
0.33 |
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| Wire diameter, mm |
0.02 ... 0.06 |
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| Welding tool automatic positioning repeatability along Õ, Y axess, not more than, mm |
0.0075 |
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| Bond force, N |
0.1...0.8 |
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| Number of wires, not less than |
1000 |
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| Bond pulse duration, sec |
0.001...0.250 |
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| USG output power, not less than, W |
4 |
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| USG working frequency, kHz |
66±6.6 |
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| Power requirements, V, Hz |
230, 50 |
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| Power consumption, kW |
0.8 |
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| Overall dimensions, mm |
1100õ770õ1500 |
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| Weight, kg |
290 |
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