Automatic Wire Bonder EM-4360K

The EM-4360K Automatic Wire Bonder is designed for thermosonic bonding of gold wires to contact pads and IC package leads.

X-Y linear step motor with feedback sensors ensures the required bonding head accuracy and speed. Z-axis bonding tool motion is driven by voice coil motor with feedback.

The machine is provided with a bond quality control system. Main process parameters such as travel speed, ball diameter, bond force, etc. are programmable.

Built-in program-driven loop library and high accuracy of executive mechanisms allow bonding a wide variety of devices with wire length (loop) up to 7 mm, including multilead VLSIs and ICs in thin packages.

Devices to be processed are fed on an endless tape by reel-to-reel handling system.

Specifications

Bonding speed 0.1 sec/wire Wire diameter 18 to 50 mkm Bonding area 50x50 mm No. of wires (max) unlimited Bonding accuracy ±4.5 mkm Bonding force 0.2 to 3.0 N Heat temperature 100 to 400°C, adjustable US generator working frequency 60.5 to 64.5 kHz (120 kHz option) US generator output power 0.2 to 5.0 W, adjustable Lead frame dimensions - length 15 to 70 mm - width 95 to 250 mm - thickness 0.1 to 0.35 mm Changeover time 5 to 10 min Compressed air pressure 0.5 to 0.6 MPa Power requirements 230 V, 50 Hz, 0.9 kW Overall dimensions 890x700x1960 mm Weight 370 kg