Automatic Wire Bonder EM-4360

The EM-4360 Automatic Wire Bonder is designed for thermosonic bonding of gold wires to contact pads and IC package leads.

X-Y linear step motor with feedback sensors ensures the required bonding head accuracy and speed. Z-axis bonding tool motion is driven by voice coil motor with feedback.

The machine is provided with a bond quality control system. Main process parameters such as travel speed, ball diameter, bond force, etc. are programmable.

Built-in program-driven loop library and high accuracy of executive mechanisms allow bonding a wide variety of devices with wire length (loop) up to 7 mm, including multilead VLSIs and ICs in thin packages.

Magazine-to-magazine handling system can be programmed for pitch and width of guiding path. Leadframe strip configuration is not specified.

Specifications

Bonding speed 0.1 sec/wire Wire diameter 18 to 50 mkm Bonding area 50x50 mm No. of wires (max) unlimited Bonding accuracy ±4.5 mkm Bonding force 0.2 to 3.0 N Heat temperature 100 to 400°C, adjustable US generator working frequency 60.5 to 64.5 kHz (120 kHz option) US generator output power 0.2 to 5.0 W, adjustable Lead frame dimensions length 15 to 70 mm width 95 to 250 mm thickness 0.1 to 0.35 mm Changeover time 5 to 10 min Compressed air pressure 0.5 to 0.6 MPa Power requirements 230 V, 50 Hz, 0.9 kW Overall dimensions 890x700x1960 mm Weight 380 kg