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EM-4340A1 Automatic Ultrusonic Bonder
EM-4340A1 Wire Bonder is intended for bonding aluminum wires to die pads and package leads by ultrasonic wedge bonding method.
The bonding head, rotating by f and movable by X, Y, Z axes, ensures the possibility to assemble power transistors in discrete packages and on tape strips as well.
The bonder allows bonding following the die-package and package-die scheme.
The value of wire cut is programmed, what allows cutting wire on a die without contact of the blade with the die.
Programmable form of ultrasonic generator bonding pulse and load pulse provide reliability and quality of bonds.
Specifications
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| Working area, mm |
60õ60 |
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| Looping time (dia 200 mkm; L=5mm, sec) |
0.8 |
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| Wire diameter, material, mkm, Àl |
100...500 |
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| Bond accuracy, mkm |
±15 |
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| Bond direction |
die-traverse,
traverse-dice |
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| Bond angle from the direction of wire loop, up to |
±90° |
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| Bond force, N |
1.5...30 |
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| USG output power, W |
0.4...40 |
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| Bond impulse duration, sec |
0.1...1 |
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| USG working frequency, kHz |
66±6.6 |
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| Power requirements |
230V, 50Hz |
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| Power consumption, kW |
1.2 |
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| Weight, kg |
220 |
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