Universal Wire Bonder EM-4320

EM-4320 Universal Wire Bonder is intended for bonding wires of a wide range of devices of electronics and can be implemented in the following models:
EM-4320-01 system intended for gold wire ball-to-wedge thermosonic bonding.
EM-4320-02 system intended for aluminum and gold wire bonding by means of wedge-to-wedge ultrasonic/thermosonic bonding.
EM-4320-03 system intended for wire bonding of increased Æ 80 to 500 mm cross-section aluminum wire by means of wedge-to-wedge ultrasonic bonding.
EM-4320-04 system intended for gold (copper, platinum, palladium etc.) wire contact bonding.

The alignment of the first bonding pad with the bonding tool as well as loop direction and, if needed, subalignment of the second contact pad is to be done manually by means of a manipulator-microscope-light pointer system. Loop bonding and loop forming, ball forming at the end of gold wire and wire cut-off from the loop are all automatic as per preset cycle.
Loop forming & bonding parameters are to be preset by means of a keyboard and can be viewed on a mini LCD display.
The ball-forming unit and the ultrasonic generator are equipped with inspection and regulation systems of preset parameters.

EM-4320 enables to: 

• bond wires on bonding pads of silicon, GaAs etc. dice; die-to-case and/or case-to-die , die-to-PCB microstrips bonding in surface mount technology;
• accomplish automatic wire bonding for dice all in a row, located at different distances between them;
• provide for low-height loop forming, the loop height being repeated for the dice located in plane;
• accomplish multi-stitch different-in-level wire bonding between dice;
• effect different-in-level bonding from die bonding pads to the case or to PCB microstrips for case-free devices;
• effect wire bonding on extra frequencies of the ultrasonic generator to reduce temperature in bond seal area;
• provide for wire bonding on bonding pads with minimum size down to 60 mm;
• provide for soft touch mode of the bonding tool and the bonding pad owing to a built-in damping device (with touch speed and touch force adjustment).

The customer can get the basic version of the system with one bonding head and/or additionally equipped with:

• the second exchangeable bonding head;
• working stage that provides for X-Y positioning;
• exchangeable bonding head, ultrasonic generator and bonding tool for thick wire;
• blowpipe for local heating of the bonding area by hot gas current;
• rotating stage which enables to effect wire bonding in perpendicular planes.

EM-4320 TZ can be further upgraded to form bump-type thick lead wires for flip-chip technology.

SPECIFICATIONS

	EM-4320-1	EM-4320-2	EM-4320-З	EM-4320-4
Bonding method	Thermosonic	Ultrasonic/thermosonic	Ultrasonic	Contact
Wire material	Au	Al / Au	Al	Au / Cu, Pl, Pa
Stage working area*	65x65	65x65	65x65*	65x65*
Round wire size, mm	0.017 – 0.075 (0.025 – 0.080)	Au: 0.017 – 0.075; Al: 0.020 – 0.080	0.08 – 0.50	0,025 – 0,100
Flat wire size, mm	—	0.02-0.03 x 0.1-0.2	—	0,02-0,03 x 0,1-0,2
Loop forming	automatic	automatic	automatic	automatic
Bonding technique	butt up – overlapping	overlapping	overlapping	overlapping
Bond force, N	0.1 – 1.5	0.1 – 1.5	0.8 – 10	0.15 – 2.0 / 2.0 – 10
Operation cycle time, s	0.8	0.8	1.0	0.8
Alignment working area, dia:
- coarse (manual), mm	85	85	85	85
- fine (manipulator), mm	15	15	15	15
Device heating temperature, °C	up to 300	up to 300	—	up to 300 / —
Bond location height difference, mm **	up to 6	up to 6	up to 6	up to 6
Number of stitches in a loop	— ***	up to 10	up to 10	up to 10
Bond pulse forming unit output/operation frequency, W/kHz	до 4/110	до 4/110до	40/66	—
Bond pulse time, s	0.010 – 0.250	0.010 – 0.250	0.010 – 0.999	0.010 – 0.999
Wire feed angle:
- basic	30°	30°	90°	30°
- additional		80°	45°
Tool penetration depth, mm	6	14 (80°)	6 (45°)	31
Power requirements	230V; 50Hz; 0.3kW	230V; 50Hz; 0.3kW	230V; 50Hz; 0.3kW	230V; 50Hz; 0.4kW
Overall dimensions (mm) and weight (kg)	750x750x600/37	750x750x600/35	750x750x600/42	750x750x600/42

*    The system can be delivered with a stage that has a working area of up to Æ 150 mm as well as with a stage that features mechanized feed of items in a carrier.

**     Possible manual adjustment of bonding level up to 10 mm.