Wire Bonders

Automatic Wire Bonder is designed for thermosonic bonding of gold wires to contact pads and IC package leads; magazine-to-magazine type

Automatic Wire Bonder is designed for thermosonic bonding of gold wires to contact pads and IC package leads; reel-to-reel type

EМ-4370 is designed for automatic ultrasonic aluminum wedge bonding of a wide variety of devices requiring a large working area and high bond accuracy, including multichip and multilevel hybrids

EМ-4340-А1 is designed for automatic ultrasonic bonding of aluminium wires of increased diameter to pads of power transistors, hybrid ICs and power modules

Universal Wire Bonder is designed for thermosonic bonding of gold wires