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Automatic Die Bonder EM-4485-K
The EM-4485-K Automatic Die Bonder is designed for attaching of dice into chip-modules on an endless tape on glue.
Die bonding unit is equipped with a high-speed linear step motor with feedback what ensures high operating speed, accuracy and reliability.
Pick-up of dice is run by means of voice coil motor with feedback.
The bonder uses microprocessor control and diagnostic system that simplifies search and fault elimination.
Pitch tape feeding, protective tape reeling, ssemiconductor wafer loading/unloading, selection of good dice from a semiconductor wafer, pick-up of a good die, die presence control in bonding tool, glue application, die bonding, die curing when heating, reeling of tape with dice using protective one on receiving reel are carried out automatically.
Specifications
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| Throughput |
6000 chips/h |
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| Working cycle time |
0.45 s |
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| Die sizes |
0.8x0.8 to 8x8 mm |
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| Bonding accuracy |
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| X, Y |
±0.025 mm |
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| angle |
±2.5° |
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| Maximum wafer diameter |
200 mm |
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| Working area |
30x40 mm |
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| Compressed air |
0.6 MPa, 0.06 m3/min |
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| Vacuum |
20 kPa |
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| Power requirements |
230 V, 50 Hz, 5 kW |
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| Overall dimensions |
3350x1050x1950 mm |
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| Weight |
800 kg |
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