 |
Automatic Die Bonder EM-4485
The EM-4485 Automatic Die Bonder is designed for eutectic bonding of dice into transistor packages type SOT-23, SOT-89 on an endless tape.
Pitch tape feeding, selection of good dice from a semiconductor wafer and die bonding are carried out automatically.
Die bonding unit is equipped with a high-speed linear step motor with feedback what ensures high operating speed, accuracy and reliability.
Pick-up of dice is run by means of voice coil motor with feedback.
Devices are fed to bonding area by reel-to-reel handling system.
The bonder uses microprocessor control and diagnostic system that simplifies search and fault elimination.
Specifications
|
| Throughput |
5000 chips/h |
|
| Working cycle time |
0.45 s |
|
| Die sizes |
0.4x0.4 to 11x11 mm |
|
| Bonding accuracy |
|
|
| X, Y |
±0.025 mm |
|
| angle |
±2.5° |
|
| Maximum wafer diameter |
200 mm |
|
| Working area |
30x40 mm |
|
| Types of devices to be processed |
SOT-23, SOT-89 |
|
| Compressed air |
0.6 MPa, 0.02 m3/min |
|
| Vacuum |
20 kPa |
|
| Power requirements |
230 V, 50 Hz, 1.5 kW |
|
| Overall dimensions |
1900x1050x1950 mm |
|
| Weight |
550 kg |
|
|
|
|
