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Automatic Die Bonder EM-4485-2
The EM-4485-2 Automatic Die Bonder is designed for attaching of dice in printed circuit boards on glue.
Handling system can be readjusted for any tape strip having width 18 to 70 mm and length 120 to 250 mm with pitch 5 to 70 mm. The indexer is automatically readjusted in accordance with strip parameters input before. The handling system feeds leadframes from stacks having height up to 100 mm with detaching pads or without and after processing loads them into magazines with capacity of 40 leadframes under slot distance 2.54 mm. The bonder can work with handling system feeding leadframes from magazines as well.
Die bonding unit is equipped with a high-speed linear step motor with feedback what ensures high operating speed, accuracy and reliability.
Pick-up of dice is run by means of voice coil motor with feedback.
The bonder uses microprocessor control and diagnostic system that simplifies search and fault elimination.
Semiconductor wafer loading/unloading, selection of good dice from a semiconductor wafer, pick-up of a good die, die presence control in bonding tool, strip (leadframe) feeding into working area, glue application, glue application quality control (drop form and area), die bonding, bond quality control, leadframe marking, and operation control and diagnostics of main units and mechanisms are carried out automatically.
Specifications
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| Throughput |
5000 chips/h |
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| Working cycle time |
0.45 s |
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| Die sizes |
0.8x0.8 to 20x20 mm |
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| Bonding accuracy |
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| X, Y |
±0.025 mm |
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| angle |
±2.5° |
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| Maximum wafer diameter |
200 mm |
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| Working area |
40x50 mm |
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| Compressed air |
0.6 MPa – 0.07 m3/min |
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| Vacuum |
20 kPa |
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| Power requirements |
230 V, 50 Hz, 1.5 kW |
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| Overall dimensions |
1850x1050x1950 mm |
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| Weight |
700 kg |
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