 |
EM-4105-Ì Automatic Die Bonder
EM-4105-Ì is designed for the epoxy die bonding to transistor, IC, LSI packages. The bonder is based on a linear step motor (LSM) and ensures an accurate die pickup from an adhesive carrier and its bonding.
EM-4105-Ì has a die recognition system and a visual bonded die inspection system. The bonder enables multiple-die device assembly.
SPECIFICATIONS
|
| Throughput, dice per hour |
2500 |
|
| Cycle time, sec |
0.7 |
|
| Wafer diameter,up to, mm |
150 |
|
| Bond accuracy: |
|
|
| - along Õ, Y axes, mm |
±0.1 |
|
| - φ, angle ° |
±5 |
|
| Die size, mm |
0.36õ0.36 ... 3.0õ3.0 |
|
| Bond duration, sec |
0.1 ... 0.9 |
|
| Bond force, N |
0.2 ... 1.2 |
|
| Consumption: |
|
|
| - compressed air, pressure, kg/ñm² |
0.6 |
|
| - vacuum, residual pressure, kg/ñm² |
0.4 |
|
| Power requirements |
230 V, 50 Hz |
|
| Power consumption, kW |
0.6 |
|
| Overall dimensions, mm |
1250õ740õ1740 |
|
| Weight, not more than, kg |
500 |
|
|
|
|
