Automatic Die Bonder EM-4085-14M

The EM-4085-14М is designed for а solder die bonding to TO-220/TO-218 power transistor packages. Leadframe strip feeding, selection of good chips from a semiconductor wafer and die bonding are carried out automatically. Multi- magazine feed system enables loading of an additional magazine with leadframe strips without interrupting the bonder operation.

The bonder uses microprocessor control and diagnostic system that facilitates troubleshooting.

Specifications

Working cycle time 0.7 s Maximum wafer diameter 150 mm Die size 1x1 to 10x10 mm Bonding accuracy: X, Y ±0.15 mm angle ±5° Maximum wafer diameter 150 mm Types of leadframes to be processed TO-218, TO-220 Compressed air 0.6 MPa – 1.4 m3/h Former-gas 0.18 MPa – 2.5 m3/h Nitrogen 0.18 MPa – 0.5 m3/h Vacuum 20 kPa Power requirements 230 V, 50 Hz, 7.5 kW Overall dimensions 1650x950x1870 mm Weight 600 kg