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Die Bonder EM-4025ÀM
The EM-4025AM Die Bonder is designed for eutectic, epoxy or soft solder bonding semiconductor chips and components in production of ICs, hybrids, diode and transistor arrays, microwave devices, and other multichip devices.
The bonder is provided with a 8-tool turret-style bond head, heated workholder with two-zone heating, epoxy pneumatic dispenser. Z-drive ensures soft touching-down required for attaching AIIIBV devices.
The bonder is capable of operating both in automatic and semiautomatic modes if manipulator alignment is needed for precision assembly. Program control enables programming of process parameters for each die (X-Y-Z locations, tool number, delay time and scrub time, scrub amplitude and frequency, epoxy application mode, epoxy pattern and dose).
A wide selection of carriers for chips and chip components makes it possible to configure the bonder in accordance with your requirements.
Specifications
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| Kinematic throughput |
2000 dice/h |
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| Die size |
0.4x0.4 to 20x20 mm |
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| Stage travel area |
400x200 mm |
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| Workholder heating temperature |
50 to 450°C |
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| Vacuum |
30 kPa |
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| Compressed air |
0.5 MPa – 0.8 m3/h |
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| Power requirements |
230 V, 50 Hz, 0.6 kW |
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| Overall dimensions |
790x750x500 mm |
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| Weight |
80 kg |
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