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Mask Making Equipment
Laser Pattern Generators
Mask Repair Systems
Mask Inspection and Metrology
Photolithography Equipment
Steppers
Mask Aligners
Wafer Inspection and Metrology
Chip Preparation Equipment
Probers
Wafer Grinders
Dicing Saws
Chip Casseting
Assembly and Packaging Equipment, Laser Processing
Die Bonders
EM-4485
EM-4485-1
EM-4485-2
EM-4485-K
EM-4105-М
EM-4085-14M
EM-4025АM
EM-4075А
Wire Bonders
Encapsulation Systems
Surface Mount Equipment
Laser Processing Equipment
Microscopy, Optical Components
Microscopes
Optical Components
Medical Equipment
Cardiology
Reanimation and intensive care
Surgery and trauma
Physiotherapy, neurology
Molds, Linear Step Motors, Sensors
Molds
Linear Step Motors
Step Motors, Sensors
Die Bonders
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Assembly and Packaging Equipment, Laser Processing
› Die Bonders
EM-4485
Automatic Die Bonder is designed for eutectic bonding of chips into transistor packages like SOT-23, SOT-89 on carrier tape
EM-4485-1
Automatic Die Bonder is designed for multi-chip assembly of ICs, LSIs by epoxy bonding
EM-4485-2
Automatic Die Bonder is designed for multi-chip assembly of ICs by epoxy bonding
EM-4485-K
Automatic Die Bonder is designed for epoxy attachment of chips into chip-modules on reel tape
EM-4105M1
EM-4105-М is designed for the epoxy die bonding to transistor, IC, LSI packages
EM-4085-14M
Automatic Die Bonder is designed for solder attaching of power transistor chips to TO-220, TO-218 leadframe strip
EM-4025AM
Die Bonder is designed for eutectic, epoxy or soft solder bonding of semiconductor chips and components in assembly of ICs, hybrids, diode and transistor arrays, microwave and other multi-chip devices
EM-4075A
Manual Die Bonder is designed for attachment of semiconductor chips by vibration eutectic bonding and epoxy bonding
Russian version
Planar Corporation
© 2003 Planar
e-mail:
planar@solo.by
Production:
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Mask Making Equipment
-Laser Pattern Generators
--EM-5189
--EM-5189-01
--EM-5109
--EM-5009BM
--EM-5062M
-Mask Repair Systems
--EM-5001B
-Mask Inspection and Metrology
--EM-6029B
--EM-6329
Photolithography Equipment
-Steppers
--EM-5084B
--EM-5434
-Mask Aligners
--EM-5026АM
--EM-5026B
--EM-5026M1
--EM-5086
-Wafer Inspection and Metrology
--EM-6479
--EM-6379
--EM-6319
--EM-6049
Chip Preparation Equipment
-Probers
--EM-6040А
--EM-6070А
--EM-6190A
--EM-6520
--EM-6520-1
--EM-6290
-Wafer Grinders
--EM-2050
--UN-1
--UU-1
-Dicing Saws
--EM-2065
--EM-2085
--EM-2085A
--EM-2048
--EM-2058
--EM-3027
--DAR
--DAR6
-Chip Casseting
--EM-4128
--EM-4208
Assembly and Packaging Equipment, Laser Processing
-Die Bonders
--EM-4485
--EM-4485-1
--EM-4485-2
--EM-4485-K
--EM-4105-М
--EM-4085-14M
--EM-4025АM
--EM-4075А
-Wire Bonders
--EM-4360
--EM-4360K
--EM-4370
--EM-4340A1
--EM-4320
-Encapsulation Systems
--EM-3037
--UG-1
-Surface Mount Equipment
--EM-4725
--EM-4217
--EM-4227
--EM-6087
-Laser Processing Equipment
--EM-250A
--EM-237
Microscopy, Optical Components
-Microscopes
--MICRO 200-01, MICRO 200T-01
--MI-1
--MI-2
--MK-1, MK-1T
--MK-3, MK-3T
--MK-AM
-Optical Components
--Aspherical parts
--Spherical parts
--Fresnel Lenses
--Prisms
--Wedges
--Parallel-sided parts
--Microlens Raster Components
--Vacuum chucks
--Antireflection coatings
--Mirrors
--Beamsplitters
--Photolithography method
--Bend Reflaction
Medical Equipment
-Cardiology
--Heart valves
-Reanimation and intensive care
--Pumps DS-08
--Pumps DS-09
--Pumps NK-02
--B-40
--B-80
--B-40A
--B-80A
--B-90
--B-100
--AEDO-07
-Surgery and trauma
--AD-1
-Physiotherapy, neurology
--SLP-1
Molds, Linear Step Motors, Sensors
-Molds
-Linear Step Motors
--LA Series
--LH Series
--LO Series
--LP Series
--LR Series
-Step Motors, Sensors
--Stepping Pulse Motors DSI-200
--Photoelectric Angular Encoder
About Planar:
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Planar Corporation Facilities
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KBTEM-SO
KBTEM-ITC
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