The system is intended for picking up dice from the carrier and placing them into cassettes. The removal of dice from the adhesive carrier is done by means of a vacuum pencil. Manual stage travel. Die center alignment by means of cross-hairs on the monitor. Two stage LSM based ejection.
SPECIFICATION
Maximum wafer diameter, mm
200
Die size, mm
1x1 to 20x20
Vacuum, MPa
0.04 to 0.03
Power requirements
230V 50Hz
Power consumption
0.5 kW
TV system- or microscope-assisted visual alignment of good dice on the carrier. Automatic die pickup from the adhesive carrier, automatic carrier travel and encapsulation.
