The EM-4128 is designed for the automatic inspection, pickup of good dice from semiconductor wafers and placement into cassettes. Good dice are deteñted by means of the high speed and precision pattern recognition system.
High speed drives with a feedback are used for wafer orientation, dice pickup, and placement into a cassette.
The system provides autodiagnostics of main electronic and mechanical units.
Specifications
Throughput
6000 chips/h
Wafer diameter
to 200 mm
Chip size
0.8x0.8 to 15x15 mm
Quantity of tools
2
Quantity of cassettes to be processed simultaneously
