The EM-3027 wafer washer is intended for washing wafers by a water jet mixed with air and for the subsequent drying after the wafer has been diced. The system uses the jet hydrodynamic cleaning method which is based on directing a water jet mixed with compressed air onto the surface to be cleaned. There are three working modes for the system: - washing - drying - automatic –washing +drying
As the washing agent DI water is used. The drying is carried out in a jet of purified and warmed air or an inert gas using the centrifugal effect, the wafer being rotated at up to 3000 rpm. Depending on the working mode the controller makes analog setting of the centrifuge rotation and also ensures the required speed and acceleration. The programmed mode of the high pressure nozzle displacement allows to make a quality cleaning of the broad range of dice. The nozzle movement can follow in three different trajectories – along a radius, along a diameter and in mixed mode. To preclude the emergency situations and damaging the wafers being washed the controller tracks the availability of water , vacuum and air in the system. For suction off the mist resulting from the impact of water jet on the wafer being cleaned the system has a manifold to which the fab ventilation suction is connected. The system is to be mounted onto the floor and is provided with shock absorbers.
