EM-2085A Wafer Dicing Saw

SPECIFICATIONS

Maximal wafer diameter 200 мм Maximal wafer thickness 3 мм Object table feed speed range от 0.1 до 600 мм/с Accumulated error of step movements(length is 200 mm), not more 0.004 мм Spindle shaft rotation frequency от 14000 до 60000 мин-1 Spindle shaft output power (rotation frequency is 60000 min-1) 1000 Вт Purified tap water 0.2 to 0.3 MPa – 0.1 m3/h Drainage line capacity 0.12 m3/h Compressed air 0.5 to 0.6 MPa – 12 m3/h Vacuum 0.03 MPa Power requirements 230V, 50 Hz, 1.8kW Overall dimensions 970x950x1400 mm Weight 500 kg