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Wafer Dicing Saw EM-2085
The EM-2085 Wafer Dicing Saw is designed for cutting on dice of wafers in tray carriers.
The system is built following trends of world practice for wafer cutting equipment of the same type, i.e. it is equipped with one high-precision electrospindle. Wafers are processed after manual alignment.
Innovating features are granite base on shock-absorbers keeping accuracy during long operating time, travel of object table on air-supports. Feedback sensors on X-Y-Z drive, non-contact control of cut depth and blade wearing, expanded processor memory, closed cutting zone have enabled to solve all the problems facing users of this type of equipment.
The system ensures cutting of semiconductor wafers made of silicone, germanium, sapphire, ceramics, gallium arsenide.
Specifications
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| Maximal wafer diameter |
200 mm |
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| Maximal wafer thickness |
3 mm |
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| Object table feed speed range |
0.1 to 450 mm/s |
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| Accumulated error of step movements(length is 200 mm), not more |
0.005 mm |
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| Spindle shaft rotation frequency * |
14000 to 60000 min-1 |
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| Spindle shaft output power (rotation frequency is 60000 min-1) |
1000 W |
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| Purified tap water |
0.2 to 0.3 MPa – 0.1 m3/h |
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| Drainage line capacity |
0.12 m3/h |
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| Compressed air |
0.5 to 0.6 MPa – 30 m3/h |
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| Vacuum |
0.03 MPa |
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| Power requirements |
230V, 50Hz, 2kW |
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| Overall dimensions |
995x1000x1755 mm |
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| Weight |
750 kg |
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