Automatic Wafer Dicing Saw EM-2065

The EM-2065 Automatic Wafer Dicing Saw is designed for cutting on dice and further cleaning of wafers in trays without any operator’s interference.

The system uses 25-cells cassettes for wafers, manipulators providing fine and coordinated feed of wafers from one position to another, automatic alignment and cutting system. While wafer cutting the blade state is constantly controlled. After wafer has been cut on dice it is transferred to cleansing station.

The whole system constantly controls all processes performed.

• protection from vibration owing to use of hard stone materials for system base and movement of subject table along X, Y, j axes on air supports;
• non-contact control of cutting blade diameter with correction of cut depth;
• program library.

Specifications

Maximal diameter 300 mm Subject table feed speed range 0.1 to 400 mm/s Spindle shaft rotation frequency 14000 to 60000 rpm Spindle shaft output power 1000 W Accumulated error of step movements(length is 310 mm), not more 0.005 mm Deionized water 0.2 to 0.3 MPa Compressed air 0.5 to 0.6 MPa Vacuum 0.04 to 0.03 MPa Power requirements 230 V, 50 Hz, 2 kW Overall dimensions 1760x1290x1700 mm Weight 1000 kg