EM-2058 System for Wafer Placement On Adhesive Carrier

EM-2058 is designed to place semiconductor wafers on a protective adhesive film before a through dicing.
The system improves the placement quality of wafers with small-size dice due to the work table heating. The system can be used both with or without the protective film. The protective film reeling mechanism is used for this purpose.

SPECIFICATIONS Wafer diameter 76,100,150,200 mm Throughput 20 wafer/hour Adhesive carrier width 225 … 285 mm Working table temperature range 40 ... 50°C Vacuum 0.02 … 0.04 MPa Power requirements 230V, 50Hz, 0.5kW Overall dimensions 480×850×320 mm Weight 40 kg