EM-2048 System for Wafer Packaging

EM-2048 Wafer Mount System is intended for mounting wafers onto frames with the adhesive carrier to fulfill the following operations:

- Through die separation
- Die placement on die sorting systems

Wafer mount is done by rarefying the air in two closing-in chambers separated by a pellicle followed by gradual decrease of rarefaction in the upper chamber. Due to growing and equally distributed vacuum load, the pellicle, like an elastic membrane, stretches and presses itself to the back side of the wafer and the frame, the adhesive layer facing the back side of the wafer and the frame. Hence, there is no mechanical impact on the wafer. Therefore, wafers cannot be damaged which is particularly relevant to extra thin wafers.

The system uses metal frames identical to the frames of PERFECTION PRODUCTION INC, USA.

Outer and inner frame diameter, mm:
169 and 130 for wafer mount of Ø100 mm wafers;
229 and 192 for Ø150 mm;
281 and 242 for Ø200 mm;
396 and 344 for Ø300 mm.

Adhesive carrier reel diameter 75 to 180 mm.

Reel width not less than 247 mm for wafer mount of Ø100 mm wafers; 304 for Ø150 mm; 357 for Ø200 mm and 472 for Ø300 mm.

Adhesive carrier basic type SWT20 (manufactured by NITTO, Japan).
Automatic attachment of the pellicle to the wafer and frame followed by trimming of the outlying part of the pellicle.

Manual installation of a reel with an adhesive carrier pellicle, wafer & frame loading, pellicle feeding and burr winding (through shuttle travel of the plunger), finished carrier unloading.
Note: Rigging (suction cups etc.) for wafer handling is to be purchased by system’s users depending on specific manufacturing conditions.

Time for reset for a different wafer size is not more than 1.5 hours.

The system includes:
- Mount unit
- Board
- Starting device
- Control panel
- Control unit

The supplier provides setup of the system which enables mounting wafers of specific size mentioned in the specification list to the contract for equipment delivery. Replaceable rigging for mounting wafers of other size is to be supplied by request.

The replaceable rigging set for wafer mount up to Ø200 mm includes contact rings for chambers’ closure and a stage for wafer and frame positioning.

For Ø300 mm wafer mount, in addition to the above parts, the supplier can provide a few additional replaceable parts of increased size by request including an upper plate of the travel mechanism, an upper chamber base and a lower chamber case.

SPECIFICATION

Throughput, wafers/hour: for Ø100 mm wafers 60 for Ø150 mm wafers 60 for Ø200 mm wafers 40 for Ø300 mm wafers 40 Wafer orientation accuracy (based on the outer diameter and the flat) relative to the frame: a) shift from the center ±1 mm b) angular orientation ±1°30` Working area heating range, °C 40 to 80 Temperature upkeep accuracy, °C ±4 Power requirements and power consumption 230V, 50Hz, 2kW Class 1 pollution compressed air pressure, not less than 0.6 MPa (6 kilogram-force/cm2) Overall dimensions, mm 1000x800x1400 Weight, kg 270