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DAR Diamond Dicing Wheels


Wheels with diamond dicing blade deposited on aluminum body by electrolytic method are intended for dicing wafers made of materials used in microelectronics. Standard fitting and outer diameters allow using wheels on any dicing equipment.

Specification

Outer diameter 56.0 mm
Inner diameter, fitting 19.05 mm
Diamond grit size 6/4, 4/2 mm
Material to be cut Silicon, GaAs, GaP, GaAsP, and others

DAR4 Diamond Dicing Wheels

Part Number Blade
Thickness, mm
Blade
Exposure, mm
Maximum
cutting depth, mm
DAR4-À 20+5 250+70 170
DAR4-À1 20+5 350+80 270
DAR4-B 25+10 250+70 170
DAR4-B1 25+10 350+80 270
DAR4-B2 25+10 400+100 320
DAR4-V 35+10 350+80 270
DAR4-V1 35+10 400+100 320
DAR4-V2 35+10 500+100 420
DAR4-V3 35+10 650+100 570
DAR4-G 45+10 400+100 320
DAR4-G1 45+10 500+100 420
DAR4-G2 45+10 650+100 570
DAR4-D 55+10 500+100 420
DAR4-D1 55+10 650+100 570
DAR4-D2 55+10 750+100 670
DAR4-D3 55+10 850+100 770
DAR4-D4 55+10 1000+100 920
DAR4-Å 65+10 650+100 570
DAR4-Å1 65+10 750+100 670
DAR4-Å2 65+10 850+100 770
DAR4-Å3 65+10 1000+100 920

Note: Our company manufacture diamond dicing wheels with diamond grit size 10/7, 14/10, 20/14, 28/20, and 40/28 microns. We can also deliver wheels meeting your special requirements to main parameters and material to be cut.

You can order a trial lot of diamond dicing wheels for testing under your manufacturing process.


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