Dicing Saws

Automatic Dicing Saw is designed for cutting wafers in frame carriers into chips followed by cleaning without operator’s assistance

Dicing Saw is designed for cutting of substrates in tray carriers into chips

Wafer Dicing Saw

EM-2048 is designed to place wafers on frame carriers having an adhesive film, with the subsequent through dicing and die bonding

EM-2058 is designed to place semiconductor wafers on a protective adhesive film before a through dicing

EM-3027 is designed for wafer washing with water-air jet and for wafer drying after dicing

Wheels with diamond dicing blade are used for cutting of various substrates used in microelectronics. DAR6 dicing wheels are manufactured with the diamond grit with the size from 0/2 to 40/28