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UH-1 Protective Film Applicator

English Main › Products › Chip Preparation Equipment › Wafer Grinders › UN-1

UH-1 Protective film applicator is designed to apply adhesive film on the planar side of a wafer.
There should be no bubble marks allowed between the adhesive film and glued wafer.

SPECIFICATIONS
Wafer diameter 76, 100, 150, 200 mm
Throughput 35 wafer/hour
Power requirements, V/Hz ~ 230/50
Overall dimensions 480×850×320 mm
Weight 40 kg

Russian version
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