Silicon Wafer Grinder EM-2050

The EM-2050 Silicon Wafer Grinder is designed for thinning of wafers which planar side is protected by the adhesive film*.

Wafer is thinned by special diamond tools according to the two-stage grinding method with the following washing and drying of the surfaces processed.

The grinder features a П-shaped gantry rigidly mounted on the foundation, two electrospindles with different grain diamond tools, and an object table on the carriage movable along an aerostatic guide. The foundation, gantry, guide, and movable carriage are made of hard stone rocks. Minimum face and radial runout of the diamond tool, high rigidity of the grinder-tool system, high precision object table, and antivibration supports ensure high processing quality and yield.

Working modes, remaining thickness are input by an operator and displayed on a monitor. Remaining thickness is checked automatically.

*To protect wafers from being damaged or crashed when grinding, the wafer planar side is covered by adhesive film. For that purpose we can offer:
- YH-1 Protective Film Applicator is designed to apply adhesive film on a planar side of a wafer.
- YY-1 Protective Film Remover is designed to remove adhesive film from a planar side of a wafer after grinding.

Wafer diameter 100, 150, 200 mm Number of spindles 2 Shaft output power 6 kW Spindle speed 1000 to 6000 rpm Throughput (removing layer 100 mm, loading/unloading time is excluded), not less for 100 mm wide wafer 60 wafer/h for 150 mm wide wafer 45 wafer/h for 200 mm wide wafer 15 wafer/h Remaining thickness of wafers processed for 100 mm wide wafer 130 mm for 150 mm wide wafer 160 mm for 200 mm wide wafer 250 mm Thickness error, not more for 100 mm wide wafer ±3 mm for 150 mm wide wafer ±4 mm for 200 mm wide wafer ±5 mm Surface roughness, not more 0.02mm Abrasive disk Diamond, cup-shaped, diameter 190 mm Power requirements 400 V, 50 Hz, 5.5 kW Overall dimensions 1300x2500x1500 mm Weight 2500 kg