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Mask Making Equipment

Laser Pattern Generators

Mask Repair Systems

Mask Inspection and Metrology

Photolithography Equipment

Steppers

Mask Aligners

Wafer Inspection and Metrology

Chip Preparation Equipment

Probers

Wafer Grinders
EM-2050
UN-1
UU-1

Dicing Saws

Chip Casseting

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Encapsulation Systems

Surface Mount Equipment

Laser Processing Equipment

Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

Wafer Grinders

English MainProductsChip Preparation Equipment › Wafer Grinders

EM-2050

Wafer Grinder is designed for thinning of semiconductor wafers with VLSI structures which planar side is protected by adhesive tape

UN-1

UH-1 Protective film applicator is designed to apply adhesive film on the planar side of a wafer. There should be no bubble marks allowed between the adhesive film and glued wafer

UU-1

UU-1 Protective Film Remover is designed to remove adhesive film from the planar side of a wafer

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