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EM-6520 Semiautomatic Prober
The semiautomatic EM-6520 prober is intended for finishing and interoperational control of LSI and VLSI on a wafer having a diameter of up to 200mm.
The prober ensures:
- electrical contact of the measuring circuits with the contact pads of the IC dice on the wafer;
- wafer tracing according to the traditional “line by line” method and through the basic points programmed relatively to the basic die;
- yield mapping of the test results;
- output of the test results onto a display;
- output of the test results onto a periphery device;
- die marking with ink.
Die marking is carried out both in the probe position and in the position displaced up to 50mm relatively the probe position.
Wafer loading and unloading is made manually.
The electronic devices and software ensure teaching-in for another device directly on the system, the parameters being saved in system’s memory, for work under conditions of multinomenclate production.
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| SPECIFICATIONS |
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| Maximum diameter of wafers being processed |
200 mm |
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| Maximum die size |
20x20 mm |
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| Die contact cycle time, not more than |
0.2 sec |
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| Die contact error on the wafer |
±7 mkm |
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| Object table heating temperature |
up to 300° Ñ |
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| Vacuum |
0.04 ... 0.03 MPa |
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| Power requirements |
230V, 50Hz, 0.8 kW |
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| Overall dimensions, not more than |
800x700x1600 mm |
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| Weight, not more than |
250 kg |
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