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Analytical Submicron Prober EM-6070À
The EM-6070A Submicron Prober is intended to ensure electrical contact between probes and semiconductor chip pattern elements and metallized buses of micron and submicron sizes, to provide visual inspection of structures as well as to localize certain features during diagnostics of internal IC block condition under normal and high temperature ranges.
A wafer heater can be installed to conduct research at high temperatures. The use of an ultrasonic cutter enables to localize a feature by cutting metallized buses.
Specifications
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| Wafer diameter, mm, max |
200 |
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| Die size, mm |
(0.4×0.4)…(20×20) |
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| Minimal size of element to be contacted, µm |
0.5 |
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| Micromanipulator travel along XYZ, mm |
10 |
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| Micromanipulator sensitivity, µm/turn |
250 |
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| Fine tuning sensitivity, µm/turn |
20 |
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| Travel by fine tuning, µm |
200 |
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| Object table heating temperature, °Ñ |
50 … 150 |
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| Microscope magnification |
25 … 2000 |
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| Power requirements, V/Hz/W |
~ 230/50/800 |
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| Overall dimensions, mm |
800×700×750 |
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| Weight, Kg |
140 |
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