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Wafer Macro Defect Inspection System EM-6379
The system is intended for visual inspection of macro defects (lack of resist washout, spallings, scratches, mud, dust, etc.) in oblique light in all production operations of semiconductor wafer process.
The system allows to shift wafers from one cassette to another without macro-inspection with orientation to the primary flat.
Specifications
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| Wafer diameter |
100 and 150 mm |
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| Cassettes |
according to SEMI standard |
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| Number of cassettes |
3 pcs |
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| Illumination area (250 mm from the source) |
> 150mm |
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| Level of illumination (over the whole area) |
> 18,000 lx |
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| Illumination with a special attachment in the center (40 mm area) |
60,000 lx |
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| Wafer tilt (X, Y) |
± 30° |
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| Wafer rotation speed |
1/30 to 1 rps |
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| Wafer rotation |
clockwise/ anticlockwise |
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| Revolutions of stage with wafer |
1 to 25 |
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| Kinematic thoughput in sorting mode |
400 wph |
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| Overall dimensions |
860 x 800 mm |
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| Weight |
140 kg |
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Operation Conditions
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| Clean room class |
10 - 1000 |
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| Power requirements |
220 V, 50 Hz |
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