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System for inspection of semiconductor wafers' unflatness
The system EM-6319 is intended for interferometer method measurement of parameters of the
unflatness of the semiconductor wafers' surface which are in straight state. The unflatness is described by the
parameters' set, answered the SEMI standards (TIR, FPD, PUA and etc.). Operator performed the choice of
parameters' set.The system provides automatic grading of semiconductor wafers from one given cassette to
three receiving cassettes by given criteria taking into account the parameters of projection equipment for
image transfer. The system provides the work in the solid grade condition (without information output) and
also in research condition with the output of information about the wafer surface form to monitor or printer
(altitude cards in modules, module grade cards, cross-section wafers' relief in any set direction and so on).
The results of the inspection of the given quantity plates' batches are kept in the computer's storage
and can be used for the next static processing.
Specifications
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| The diameter of inspected wafers |
100, 150 and 200 mm |
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| Accuracy of unflatness is no more than |
± 0.05 µm (mkm) |
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| The convergence of measurement results |
0.015 µm (mkm) |
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The maximum difference of the relief
altitude of wafer surface on the length 10 mm |
no more 2.5 µm (mkm) |
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Kinematic throughput
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| 100 mm |
90 |
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| 150 mm |
75 |
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| 200 mm |
60 |
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