Mask Aligner EM-5026M1
The mask aligner is intended for photomask-to-wafer alignment and transfer of mask pattern onto wafer by contact exposure of wafer photoresist in photolithographic processes of IC and semiconductor devices production.
The EM-5026M manual system is intended for laboratory researches and small batch production.
The distinctive feature of the system is the possibility to expose not only silicon wafers, but wafers of more fragile materials as gallium arsenide as well. This is provided by special design of mechanisms.
The system has a single-field microscope with three objectives on turret head and alignment manipulator with high sensitivity of fine drives along X, Y and theta.
The use of the mechanism of vertical travel of increased rigidity and a new-type clamp system has enable shift-free wafer-to-mask contact.
Wafer leveling by special glass calibrators has let to significantly diminish damages and pollution of the working surfaces of photomasks.
The system enhances technological capability in semiconductor devices production due to the possibility to expose wafers in vacuum contact with adjustable compression force.
Specifications
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| Throughput |
10 wafers/hour |
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| X, Y alignment accuracy |
±0.1 μm |
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| Photolithography resolution |
0.4 – 0.6 μm |
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| Working wavelength, λ |
225 – 260 nm |
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|
280 – 335 nm |
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|
350 – 450 nm |
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| Illumination uniformity (70-mm dia. working field) |
3% |
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| * Wafer diameter (max) |
60 mm |
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| Nonflatness of wafer worksurface under vacuum clamp |
not more than 1 μm |
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| Mask sizes |
4”x 4” (102 mm x 102 mm) |
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|
3” x 3” (76 mm x 76 mm)* |
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| Exposure mode |
Contact (compression force adjustable) |
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| Weight |
350 kg |
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*On customer’s request the system can come complete with changeable parts to expose 16, 20, 25, 30, 40 and 50 mm diameter wafers.
Utilities: Power requirements: 220V, 50 Hz, up to 1 kW
Footprint 8 m2
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