Maskaligner EM-5026B
The aligner is intended to align photomask image on the back side of semiconductor wafer and to transfer photomask image to the front side of the wafer by means of contact exposure of photoresist layer on the wafer during photolithographic processes of IC and semiconductor devices production.
Brief Description The aligner features manual loading of wafers onto the precise orientation stage, automatic loading of wafers from the orientation stage onto the working stage , automatic wafer leveling and setting of the proximity gap, manual alignment of photomask image and the image on back side of the wafer using a special microscope, automatic exposure of photoresist on the wafer, automatic unloading of the wafer from the working stage onto the orientation stage.
* To a special order the aligner can be provided with changeable parts to expose 40 mm, 51 mm, 60 mm and 100 mm diameter wafers.
Specifications
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| Throughput (at 20 s exposure time) |
10 wafers/hr |
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| X, Y alligment accuracy |
±0.1 µm |
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| Photolithography resolution limit |
1 µm |
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| Ranges of working wavelength |
225...260 nm |
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280...335 |
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350...450 nm |
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| Illumination uniformity within the 100 mm diameter working field |
5% |
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| *Wafer diameter |
76 mm |
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| Wafer thickness |
0.3 - 0.65 mm |
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| Flatness deflection of the wafer working surface under vacuum fastening |
not more than 1 µm |
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| Mask size |
*3”x3” (76x76 mm) |
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4”x4” (102x102 mm) |
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*5”x5” (127x127 mm) |
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| Mask thickness |
3 mm |
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| Exposure mode |
contact exposure (compression force adjustable) |
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* To a special order the alligner can be provided with changeable part to expose 40 mm, 51 mm, 60 mm and 100 mm diameter wafers
Operating Conditions The aligner is designed for operation in clean room. Opto-mechanical unit - Class 100. Control system - Class 10 000.
Power supply of the aligner is provided from AC power line 220 V ± 10%, 50 Hz ± 2%; power consumption up to 1kW; footprint 8 m2. Weight 500 kg.
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