Mask Aligner EM-5026АM

The Mask Aligner isdesigned for alignment of photomask patterns with semiconductor wafer and pattern transfer from the photomask to the wafer by contact explosure of the wafer photoresist coating in production of ICs and semiconductor devices.

The mask aligner can expose not only semiconductor wafers but also more brittle plates, for example gallium arsenide plates, due to special design of the wafer transfer and orientation systems.

The system is equipped with an automatic wafer loader/unloader, a two-field microscope with split-field and an alignment manipulator with high sensitive X,Y motion.

A vertical elevator of increased robustness and a gripper system of a novel type provide a shift-free wafer-to-photomask contact.

Automatic loading and unloading without the use of jet transport, wafer transfer and leveling by means of special carriers and glass calibration plates cut down considerably the damages and contamination of the wafer working surfaces.

The mask aligner expands technological capabilities in production of semicomductor devices due to exposure of the wafers in contact with adjustable compression force.

The mask aligner uses standard cassettes and it can be used independently and as a part of photolithography automated lines as well.

Specifications

Throughput (at 5 s exposure time and without aligment time) 120 wafers/hr X, Y aligment accuracy ±0,1 µm Photolithography resolution limit 0.4 to 1 µm Ranges of working wave length 225...260 nm 280...335 nm 350...450 nm Illumination uniformity over 100 mm diameter working field 5% *Wafer diameter in automatic loading mode 76 mm Nonflatness of wafer working surface under vacuum clamp < 1 µm Mask size 4”x4” (102x102 mm) 5”x5” (127x127 mm) Mask thickness 3 mm Exposure mode contact exposure (compression force adjustable) Weight 400 kg

The system is designed for operation in clean room Class 100 - 10000.  Power supply 220 V, 50 Hz; power consumption up to 1kW; footprint 8 m².