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Automatic Mask Inspection System EM-6329
The system is designed for automatic detection of pattern defects on master masks, reticles and work masks used in production of ICs, semiconductor devices and hybrid ICs.
Defect inspection method uses a die-to-database comparison. The system detects mask defects of all types according to SEMI standard: pinholes, pindots, protrusions, mouse bites, breaks, shorts, missing and unwanted features, coordinate and size shifts, corner rounding. Mask coatings: chrome, chrome + oxide, molybdenum, iron oxide.
Main features:
- defects monitoring mode whereby the operator can observe the defects on the display screen or in the microscope (in transmitted and reflected light);
- automatic filtering of false defects at edges of features;
- possibility of programmed filtering of specified size defects;
- defects classification according to SEMI standard;
- the system can include an automatic mask loader using cassettes, individual dust-proof boxes or SMIF-containers;
- inspection of pellicle-protected masks;
- availability of defect analysis system.
Specifications
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| Detection threshold |
0.25, 0.5 µm |
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| Working field |
153 x 153 mm |
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| XY-stage resolution |
0.005 µm |
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| Automatic inspection throughput: |
5.0 mm2 at 0.25 µm threshold |
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10.0 mm2 at 0.5 µm threshold |
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| Mask sizes |
SEMI standard |
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| Power requirements |
220V, 50 Hz, 2 kW |
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| Overall dimensions |
1280 x 1360 x 1210 mm |
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| Weight |
1200 kg |
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