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EM-5084B
EM-5434

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Wafer Stepper EM-5084B


EM-5084 B is intended for alignment and die-to-die projection exposure of semiconductor wafers in LSI and VLSI production.

The principle of operation consists in sequential transfer (step-and-repeat) of the reduced in size reticle image onto a prefocused, aligned with the reticle image plane semiconductor wafer, oriented by alignment marks applied to its working surface.

ÑONFIGURATION

EM-5084B consists of the following units:

  • Control unit
  • X,Y stage with a three-coordinate laser measuring system based on interferometers
  • Focusing and leveling system
  • Image analysis system (IAS)
  • Reticle-to-wafer photoelectric alignment system
  • Projection system, including 5x projection lens, illumination unit and light energy dose system
  • Wafer loading unit
  • Reticle loading unit
  • The alignment can be carried out in two ways :

    • global alignment by 2, 4, 9, 16 and 25 marks;
    • die-to-die alignment.

    The machine is equipped with an automatic system of reticle loading onto the working position from special dust-proof containers of “Entegris” company.

    Specifications
    Operating wavelength 404 nm
    Reduction ratio 1:5
    Maximum working field 16 x 16 mm
    Minimum feature size 0.8 µm
    Alignment accuracy ± 0.1 µm
    Wafer diameter 150 mm, 200mm
    Reticle size 127 x 127 mm
    Reticle library capacity 12 ps.
    Throughput (wafer diameter 150 mm) 45 wafers/hour
    Weight 2900 kg
    Operating Conditions
    Clean room:
    Machine unit Class 10
    Control system Class 10 000
    Power requirements 220 V, 50 Hz
    Power consumption 3,5 kW
    Footprint 13 m2 (5 m2 in Class 10 clean room, 8 m2 in Class 10 000 clean room)

    Russian version
    PLANAR
    Planar Corporation
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