Assembly and Packaging Equipment, Laser Processing
The die bonding and wire bonding equipment, with due account of labor-intensiveness of these operations, are the most significant systems in the whole process flow of assembly production.
The whole history of Planar Concern is related to the development of this kind of equipment – from manual systems with the alignment of bonding tool, wire and bonding pad with the help of microscope and micromanipulator (the first system was produced in 1963) to fully automated systems equipped with pattern recognition systems and automatic loading – unloading systems.
At present Planar Concern produces a variety of assembly equipment with respect to the level of automation and bonding methods.
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