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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy

Microelectronics Microscopes

Material Science

Biology

Medical Equipment

Cardiology

Assembly and Packaging Equipment, Laser Processing

English MainProducts › Assembly and Packaging Equipment, Laser Processing

The die bonding and wire bonding equipment, with due account of labor-intensiveness of these operations, are the most significant systems in the whole process flow of assembly production.

The whole history of Planar Concern is related to the development of this kind of equipment from manual systems with the alignment of bonding tool, wire and bonding pad with the help of microscope and micromanipulator (the first system was produced in 1963) to fully automated systems equipped with pattern recognition systems and automatic loading unloading systems.

At present Planar Concern produces a variety of assembly equipment with respect to the level of automation and bonding methods.


Die Bonders
Wire Bonders
Wafer Bonders
IC Pretreatment Equipment
Laser Processing Equipment


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