In this section you will find the equipment for various operations with semiconductor wafers prior to the assembly process itself - from wafer thinning (grinding) up to chip cassetting. For the reason of incoming testing of wafers before the assembly operations we found it expedient to show our probers here as well, which have been developed and produced by our company since 1964.
Equipment shown in this section has been produced by Planar Concern for many years but wafer grinders. As for the wafer grinders, in spite of certain novelty of this operation in the process flow of semiconductor industry, by now we have developed second generation of such equipment which is successfully used at foreign and CIS semiconductor manufacturers.
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