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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems


Equipment for wafer pattern generation and inspection


Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment


Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy, Optical Components


Medical Equipment


Chip Preparation Equipment

English MainProducts › Chip Preparation Equipment

In this section you will find the equipment for various operations with semiconductor wafers prior to the assembly process itself - from wafer thinning (grinding) up to chip cassetting. For the reason of incoming testing of wafers before the assembly operations we found it expedient to show our probers here as well, which have been developed and produced by our company since 1964.

Equipment shown in this section has been produced by Planar Concern for many years but wafer grinders. As for the wafer grinders, in spite of certain novelty of this operation in the process flow of semiconductor industry, by now we have developed second generation of such equipment which is successfully used at foreign and CIS semiconductor manufacturers.

Wafer Grinders
Dicing Saws
Die Control and Cassetting Systems

Russian version
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